I have a Bambu Labs P1P with the enclosure kit option. I have struggled with the nozzle and fan speed settings while printing an SL-9 lower with Polymaker PLA Pro. I wondered what setting you recommend for fan speeds, nozzle speeds, and nozzle temperature. My nozzle temperature is set for 210C for the initial layer and 190C for the layers afterward. I don't have issues with print adhesion to the bed. Thank you.

    jzurin Nozzle temp is too low for later layers. I'd recommend at least 210 for all layers. You can print at 190 but it's quite on the low end. Fan speed as low as you can set it without getting really bad overhangs. My P1S can do 40% fan pretty well but it'll depend for you. I'd recommend staying less than 100mm/s for all speeds. I've found my sweet spot to be 80mm/s for a best compromise between speed, print quality, and strength.

    All of these really depend, so you'll have to play with it a bit. My recommended starting point:

    • 210+ temp all layers
    • 50% or less fan, but more isnt the end of the world. If you experience bad curing then you may need more fan. PLA loves to be cooled. I get away with 70% fan and get great strength if I need it. Helps with curling and overhang quality a ton.
    • 100mm/s all speed or less. More is fine but I wouldnt go anywhere near 200mm/s for 2a prints. You need all the layer adhesion you can get.

    Hope that helps a bit!

      This is very helpful, and I will try it out! I appreciate your help.

      marriedwchildren256 Kinda, again the answer depends. It's been proven now that too much cooling can lead to worse layer adhesion but factors like nozzle temp and print speed play into the equation. Generally, if you can get away with less cooling you will do much better with strength, overall at least.

      I've seen people crank their temps to like 230, print faster and just max cool. I can see the benefit to that as you can get your better overhangs, corners and supports with the max fan but also still print hot enough to encourage the maximum layer adhesion pla has to offer. I havent played with it too much but I have done near max fan (Max fan on the P1S is annoying) in the past with hotter nozzle temps and it turned out fine 🙂

      Some supplemental youtube videos if you're interested:
      https://youtu.be/PPyiACzsLWM?si=2IGwJ5ujzWBj0a9y
      https://youtu.be/SWKhB_4WTkc?si=o2DgHP6dTNE18poa

      4 days later

      Yes. Layer adhesion is a combination of a number of factors, but the temperature of the base layer is the most critical. More cooling will lower that temperature in some cases, resulting in less adhesion. However, with large parts, the cooling happens anyway. Because of this I recommend full cooling due to the improvements of overhangs.

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